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SK Hynix Unveils iHBM Tech to Enhance AI Chip Cooling Efficiency, XL2CSOPHYNIX (07709.HK) Leaps 14%+
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Shares of SK Hynix ballooned more than 6% in South Korea this morning (26th), lifting the KOSPI to a record high after the company unveiled its next-generation high-bandwidth memory technology, iHBM. The new solution integrates a cooling component (ICE) into high-bandwidth memory (HBM) packaging, structurally addressing the most critical heat dissipation challenge faced by AI chips. One of the key advantages of the new technology is improved product compatibility. Major tech clients such as NVIDIA Corporation (NVDA.US) can immediately adopt iHBM in their next-generation systems without significant standalone design modifications. In Hong Kong, XL2CSOPHYNIX (07709.HK) last quoted at HKD110.75, up 14.15%, with turnover of HKD2.505 billion. XL2CSOPSMSN (07747.HK) last quoted at HKD158.95, up 4.5%. Auto-translated by AI This article was automatically translated by AI, the original language version should be considered the authoritative version. AASTOCKS.com Limited does not guarantee its accuracy or completeness and accepts no liability for any damages or losses arising from the use of this translation. More Details
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