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<Research>Daiwa: Huawei's New Semis Theory Entails Positive Surprise, Signaling Breakthroughs in Design and Mfg
HiSilicon, a subsidiary of Huawei, officially launched its new chip design principle, the "Tau Scaling Law", yesterday (25th), Daiwa said in its report. The new framework...
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<Research>Daiwa: Huawei's New Semis Theory Entails Positive Surprise, Signaling Breakthroughs in Design and Mfg
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HiSilicon, a subsidiary of Huawei, officially launched its new chip design principle, the "Tau Scaling Law", yesterday (25th), Daiwa said in its report. The new framework adopts a time scaling as the guiding principle to enhance chip density and system performance, replacing the prevailing geometric scaling law.

Through its LogicFolding architecture, it shortens critical path routing and reduces signal propagation delays, thereby significantly improving transistor density and performance. Meanwhile, its full-stack software and interconnect protocols help lower execution time and system communication latency.

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The report noted that HiSilicon plans to launch a new-generation Kirin chip in autumn 2026, which will be the first product based on the LogicFolding architecture. Its performance is expected to show a marked improvement over the current Kirin 9030, which adopts the N+3/5nm process. HiSilicon aims to develop chips with performance comparable to a 1.4nm process by 2031 through the Tau Scaling Law.

The broker believes that HiSilicon's proposed Tau Scaling Law is essentially based on 3D IC principles, improving system-level performance by reducing communication latency and signal propagation delays. Although the industry has long recognized 3D packaging as a key development direction for China's semiconductor sector, HiSilicon's formal announcement still delivered a positive surprise, signaling breakthroughs in both design and manufacturing. The broker reiterated its positive view on China's semiconductor supply chain.

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