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《大行》大摩：ASMPT(00522.HK)首季訂單創四年高 次季展望樂觀 評級「增持」
摩根士丹利發表研究報告指出，ASMPT(00522.HK)公布首季業績，期內訂單達7.27億美元，按季增長46%，按年增長72%，創四年最高水平，優於該行預期。首季訂單出貨(Book-to-bill)比率為1.43，受惠AI伺服器、光收發器及中國電動車強勁需求，SMT分部錄得創紀錄訂單；SEMI分部訂單增長則受中國外判半導體裝嵌測試(OSAT)、高端智能手機...
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《大行》大摩：ASMPT(00522.HK)首季訂單創四年高 次季展望樂觀 評級「增持」
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摩根士丹利發表研究報告指出，ASMPT(00522.HK)  -5.300 (-3.121%)    Short selling $22.27M; Ratio 3.236%   公布首季業績，期內訂單達7.27億美元，按季增長46%，按年增長72%，創四年最高水平，優於該行預期。首季訂單出貨(Book-to-bill)比率為1.43，受惠AI伺服器、光收發器及中國電動車強勁需求，SMT分部錄得創紀錄訂單；SEMI分部訂單增長則受中國外判半導體裝嵌測試(OSAT)、高端智能手機相關應用、AI相關電源管理應用及光收發器需求帶動。

該行表示，ASMPT首季收入41億港元，按年增長30%，較該行預期高出4%；純利2.54億港元，按年大升207%，較該行預期高出10%。公司預計次季收入介乎5.4億至6億美元，以中位數計按季增長12.2%，按年增長37%，分別較該行及市場預期高出5%及7%，增長主要由SEMI分部帶動。

大摩指出，ASMPT在熱壓焊接(TCB)領域的領導地位持續，首季錄得晶片到基底(C2S)的大規模出貨及重複訂單，並有4部晶片到晶圓(C2W)工具訂單。記憶體方面，一家主要客戶已就其HBM 16H產品通過AOR fluxless工藝認證。該行預期OSAT資本開支於2026年將再增長34%，SEMI及SMT分部均有望實現強勁業績，維持「增持」評級，目標價148港元。(ec/u)(HK stocks quote is delayed for at least 15 mins.Short Selling Data as at 2026-04-29 16:25.)

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