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據報高通(QCOM.US)與長鑫存儲合作開發移動裝置記憶體方案 應對供應短缺
多間媒體引述南韓《中央日報》報道，高通(QCOM.US)正與中國記憶體生產商長鑫存儲合作，開發針對移動裝置客製化記憶體解決方案，以緩解當前記憶體短缺及成本攀升問題。目前全球記憶體產能正快速向人工智能傾斜，大量動態隨機存取記憶體(DRAM)產能轉向生產高頻寬記憶體(HBM)，導致供應智能手機記憶體資源遭到排擠，影響對中低階智能手機尤為明顯。有外媒報道指，以入門...
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據報高通(QCOM.US)與長鑫存儲合作開發移動裝置記憶體方案 應對供應短缺
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多間媒體引述南韓《中央日報》報道，高通(QCOM.US)      正與中國記憶體生產商長鑫存儲合作，開發針對移動裝置客製化記憶體解決方案，以緩解當前記憶體短缺及成本攀升問題。

目前全球記憶體產能正快速向人工智能傾斜，大量動態隨機存取記憶體(DRAM)產能轉向生產高頻寬記憶體(HBM)，導致供應智能手機記憶體資源遭到排擠，影響對中低階智能手機尤為明顯。有外媒報道指，以入門手機為例，DRAM成本佔整體物料成本約35%，連同閃存約佔19%成本，兩者合計達54%，令產品定價及出貨面臨壓力。

此外，聯發科與高通近期亦傳出下調主要應用於中低階智能手機的4奈米晶片產量，減產規模約2萬至3萬片晶圓。(fc/da)(Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

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