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CICC Approved to Issue Max. RMB9.8B Tech Innovation Bonds
CICC (03908.HK) recently received the "Decision on Granting Administrative Permission" (Yin Xu Zhun Yu Jue Zi No. [2025] 72) issued by the People's Bank of China (PBO...
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CICC Approved to Issue Max. RMB9.8B Tech Innovation Bonds
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CICC (03908.HK)  +0.140 (+0.830%)    Short selling $28.86M; Ratio 4.423%   recently received the "Decision on Granting Administrative Permission" (Yin Xu Zhun Yu Jue Zi No. [2025] 72) issued by the People's Bank of China (PBOC), as announced by CICC.

Pursuant to the decision, the PBOC agreed to allow the Company to issue up to RMB9.8 billion in technology innovation bonds in the national interbank bond market, which would be used exclusively to support investment and financing in the field of scientific and technological innovation area.

Related NewsM Stanley Expects CICC (03908.HK) Shr Price to Rise in Next 30 Days
The administrative permission is valid from 11 June 2025 to 10 June 2027. The Company can independently choose the timing of issuance in stages within the validity period.
(HK stocks quote is delayed for at least 15 mins.Short Selling Data as at 2025-06-16 16:25.)

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