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XIAOMI-W AI Chip 'XRING O3' to Be Produced Using TSMC 3nm Process: Wire
2026-08-24 15:38:43 XIAOMI-W (01810.HK) launched the AI chip "XRING O3" for terminal products. Reuters, citing people familiar with the matter, reported that the chip will be manufactured by TSMC (TSM.US) using 3-nm process. It is expected to be used in XIAOMI-W's upcoming flagship foldable smartphone, with a shipment target of 200,000-300,000 units. XIAOMI-W said it commissioned TSMC to manufacture the "XRING O100" and "XRING D100". The "XRING O3" entered mass production, while the "XRING O100" and "XRING D100" completed development and were expected to be applied next year. ~ AASTOCKS Financial News Website: www.aastocks.com | |