Advanced Micro Devices, Inc. (AMD.US) plans to invest over USD10 billion in Taiwan's semiconductor industry to expand strategic partnerships and enhance advanced packaging capabilities required for AI infrastructure.AMD CEO Lisa Su stated that as AI adoption accelerates, the company's global customers are rapidly scaling up AI infrastructure to meet growing computing demand. Related NewsBuilding Permits Prel for Apr in United States is 1.442M, higher than the previous value of 1.363M. The forecast was 1.39M.The company also said it will begin manufacturing its next-generation central processing unit, Venice, in Taiwan using the 2nm technology of Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) . It also plans to produce the chip at TSMC's wafer fabrication plant in Arizona in the future. (Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)
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