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Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Raises 2030 Global Semiconductor Market Forecast to Over USD1.5 Trillion
Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) expects the global semiconductor market to exceed USD1.5 trillion by 2030, higher than its previous forecast of USD1 trilli...
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Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Raises 2030 Global Semiconductor Market Forecast to Over USD1.5 Trillion
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Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US)      expects the global semiconductor market to exceed USD1.5 trillion by 2030, higher than its previous forecast of USD1 trillion. Among the total USD1.5 trillion market, AI and high-performance computing will account for 55%, followed by smartphones at 20% and automotive applications at 10%.

The company said it will continue to accelerate capacity expansion this year and plans to build nine new wafer fabs and advanced packaging facilities. It will also significantly increase capacity for its most advanced 2-nanometer chips and next-generation A16 chips, with the CAGR projected to reach 70% from 2026 to 2028. In addition, capacity for advanced packaging technology CoWoS is expected to record a CAGR of more than 80% between 2022 and 2027.

Related NewsIndustrial Production MoM for Apr in United States is 0.7%, higher than the previous value of -0.5%. The forecast was 0.3%.
Taiwan Semiconductor Manufacturing Company Ltd. stated that its first wafer fab in Arizona, the United States, has commenced production. Equipment relocation for the second fab will take place in 2H26, while the third fab remains under construction. Construction of the fourth fab and its first advanced packaging facility is expected to begin this year. In Japan, the first wafer fab has started mass production of 22-nanometer and 28-nanometer products, while the second fab has been upgraded to a 3-nanometer process to meet market demand. (mn/da)(Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

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