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Report: SK Hynix Considering Adopting Intel Corporation (INTC.US) New Packaging Technology
According to foreign media reports, SK Hynix is considering adopting the 2.5D packaging technology "Embedded Multi-die Interconnect Bridge (EMIB)" developed by Intel Corporation (I...
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Report: SK Hynix Considering Adopting Intel Corporation (INTC.US) New Packaging Technology
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According to foreign media reports, SK Hynix is considering adopting the 2.5D packaging technology "Embedded Multi-die Interconnect Bridge (EMIB)" developed by Intel Corporation (INTC.US)      . The technology is currently undergoing testing, and the company is seeking suitable materials and components for mass production.

The report noted that several major technology companies are closely monitoring the development of EMIB, viewing it as an alternative to the CoWoS solution offered by Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US)      . EMIB is said to feature lower power consumption, lower packaging costs, and scalable support for large heterogeneous integration systems.

Related NewsPPI YoY for Apr in United States is 6.0%, higher than the previous value of 4.3%. The forecast was 4.9%.
Ming-Chi Kuo, an analyst at TF International Securities, revealed that the backend yield rate of Intel Corporation's EMIB advanced packaging has improved to above 90%. However, Intel Corporation is currently using FCBGA as the benchmark to measure EMIB production yield. Industry-wide FCBGA production yields are generally at 98% or higher. (mn/a)(Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

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