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TSMC Targets to Build Chip Packaging Plant in Arizona by 2029
Kevin Zhang, Deputy Co-COO and SVP of Business Development and Global Sales at TSMC (TSM.US), remarked that the company plans to establish a chip packaging plant in Arizona by 2029...
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TSMC Targets to Build Chip Packaging Plant in Arizona by 2029
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Kevin Zhang, Deputy Co-COO and SVP of Business Development and Global Sales at TSMC (TSM.US)      , remarked that the company plans to establish a chip packaging plant in Arizona by 2029. It will actively expand the production capacity of its Arizona facilities, aiming to build CoWoS and 3D-IC capacity by 2029.

By far, Apple (AAPL.US)      and Nvidia (NVDA.US)      have been sourcing chips from TSMC's Arizona plant, but many of these chips still need to be shipped back to Taiwan for packaging. Amkor Technology (AMKR.US)      and TSMC previously announced in 2024 that they would collaborate to introduce several of TSMC's advanced packaging technologies to Arizona.
(Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

Related NewsAPI Crude Oil Stock Change for Apr/17 in the United States is -4.400M, lower than the previous value of 6.100M. The forecast was -1M.

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