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ICBC Issues RMB20B Technological Innovation Bonds
ICBC (01398.HK) (601398.SH) has taken the lead in issuing the first batch of technological innovation bonds, according to ICBC. The issuance of technological innovation bonds, with...
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ICBC (01398.HK)  +0.080 (+1.455%)    Short selling $163.57M; Ratio 13.258%   (601398.SH)  +0.060 (+0.838%)   has taken the lead in issuing the first batch of technological innovation bonds, according to ICBC. The issuance of technological innovation bonds, with a size of RMB20 billion, is the largest financial-type technological innovation bond issued in the first batch.

Among the 36 projects of technology enterprises and equity investment organizations announced in the first batch, ICBC acted as the lead underwriter for 12 projects.
(HK stocks quote is delayed for at least 15 mins.Short Selling Data as at 2025-05-13 12:25.) (A Shares quote is delayed for at least 15 mins.)

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